US chipmaker Intel and Arizona-based 3D Glass Solutions have signed an agreement with the Odisha state government to set up an advanced packaging glass substrate manufacturing facility in the state. The proposed investment stands at around $3.3 billion and is expected to create over 1,800 direct high-skilled jobs.
The facility will produce glass-core and high-density interconnect substrates used in advanced semiconductor packaging — the base layer on which chip components are mounted. These are key inputs for AI hardware, high-performance computing, telecom equipment, and next-generation electronics.
Intel will serve as the technology partner, bringing process expertise, technology licensing, quality systems, and workforce development to the project.
The MoU was disclosed via a post on X by Odisha Chief Minister Mohan Majhi. A production timeline has not been publicly confirmed.
The project would give India a position in a higher-value segment of the semiconductor supply chain, as the central government pushes to build domestic chip manufacturing capacity under its semiconductor mission.
